Academician of the American Academy of Engineering, Academician of the Chinese Academy of Engineering, Professor of the Chinese University of Hong Kong
Professor C. P. Wong is the Charles Smithgall Institute Endowed Chair and Regents’ Professor. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University. Prior to joining Georgia Tech, he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992.
His research interests lie in the fields of polymeric materials, electronic packaging and interconnect, interfacial adhesions, nano-functional material syntheses and characterizations, nano-composites such as well-aligned carbon nanotubes, grahenes, lead-free alloys, flip chip underfill, ultra high k capacitor composites and novel lotus effect coating materials.
He received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the Georgia Tech Sigma Xi Faculty Best Research Paper Award in 1999, Best MS, PhD and undergraduate Thesis Awards in 2002 and 2004, respectively, the University Press (London) Award of Excellence, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class of 1934 Distinguished Professor Award in 2004, Outstanding Ph.D. Thesis Advisor Award in 2005, the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006, the Sigma Xi’s MonieFerst Award in 2007, the Society of Manufacturing Engineers (SME)’s TEEM Award in 2008, the 2009 IEEE CPMT David Feldman Outstanding Contribution Award and the 2009 Penn State University Distinguished Alumni Award. The 2012 International Dresden Barkhausen Award (Germany).
He holds over 65 U.S. patents, numerous international patents, has published over 1000 technical papers, 12 books and is a member of the National Academy of Engineering of the USA since 2000, and a foreign academician of the Chinese Academy of Engineering 2013.
美国国家工程院院士、中国工程院外籍院士、香港科学院创院院士、香港中文大学工程学院院长及卓敏电子工程学讲座教授 。
1975年汪正平从宾夕法尼亚州州立大学博士毕业后到斯坦福大学作博士后研究；1977年加入贝尔实验室工作，先后担任研究员、首席科学家、杰出科学家；1992年获颁国际电气与电子工程师学会会士；1995年进入乔治亚理工学院执教；2000年当选为美国国家工程院院士；2010年全职回国，被聘为香港中文大学工程学院院长，电子工程讲座教授；2011年被聘为中国科学院深圳先进技术研究院“先进电子封装材料”广东省创新科研团队带头人、电子封装材料方向首席科学家；2013年当选中国工程院外籍院士；2015年当选为香港科学院创院院士 [3] 。
汪正平长期从事电子封装研究，在封装材料领域已发表学术论文1000多篇，申请美国专利60余项，被IEEE授予电子封装领域最高荣誉奖——IEEE元件、封装和制造技术奖 。